Chip — Module — Package interfaces

Abstract

The complexity of the interfaces between packaging levels continues to increase as integration proceeds at the semiconductor chip. The increased terminal count at the chip (as a result of the increasing number of circuits and chip size) requires increasing printed circuit wiring capability in the module. As more and larger chips are packaged on the module, additional pins must be interfaced to the board. Thus, the demand for printed circuit wiring is dramatically increasing at the board level. This paper describes a design example which is carried through from chip-to-module-to-board in simple terms to illustrate the interaction between the various levels of packaging. The interfacial considerations are considered briefly with reference to new packaging developments. Most of the technology is centered on the printed circuit board.