Precise forming of Ti60 alloy by superplastic forming /diffusion bonding

Abstract

Abstract. The study investigated the high-temperature tensile behavior of Ti60 alloy at different temperatures (940"℃" to 1040"℃" ) and different strain rates (0.1s-1 to 0.0005s-1). Ti60 exhibited superplasticity with the best deformation temperature ranging from 940"℃" to 960"℃" . The elongation of the samples decreased significantly at the temperatures over 980"℃" due to the growth of grain size. In addition, the study investigated the influence of diffusion bonding temperature and pressure on the microstructure and mechanical properties of the joint. The results showed that there was no microscopic gaps or cracks at the interface of the diffusion bonding joints performed at 2.5MPa, 920"℃" and 2 hours. Thereafter, a four-layer structure of Ti60 alloy was fabricated through the SPF/DB. The component with uniform thickness distribution, high surface quality, high diffusion bonding quality was achieved.