K. Agawa, I. Seto, A. Happoya, Y. Iida, Yusuke Imaizumi, M. Okano, Daigo Suzuki, Yuichi Sato, Masaomi Iwanaga, Kazumi Sato, S. Arai, Noriaki Uchida, Koji Ryugo, D. Miyashita, R. Fujimoto, Y. Unekawa
{"title":"3D-integrated, low-height, small module design techniques for 4.48GHz, 560MHz-bandwidth TransferJet™ transceiver","authors":"K. Agawa, I. Seto, A. Happoya, Y. Iida, Yusuke Imaizumi, M. Okano, Daigo Suzuki, Yuichi Sato, Masaomi Iwanaga, Kazumi Sato, S. Arai, Noriaki Uchida, Koji Ryugo, D. Miyashita, R. Fujimoto, Y. Unekawa","doi":"10.1109/RWS.2014.6830099","DOIUrl":null,"url":null,"abstract":"A low-height, small module for 4.48GHz carrier frequency, 560MHz bandwidth transceiver has been designed employing 3D integration technology. An LSI integrated with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a small module size of 4.8mm × 4.8mm × 1.0mm. Since RF signals are degraded by parasitic capacitance associated with the low height and small footprint of the module, three design techniques are proposed in the paper. The module realizes the world's smallest size, and achieves sufficient transmitter modulation accuracy and receiver sensitivity, which meet TransferJet™ standards.","PeriodicalId":247495,"journal":{"name":"2014 IEEE Radio and Wireless Symposium (RWS)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE Radio and Wireless Symposium (RWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RWS.2014.6830099","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
A low-height, small module for 4.48GHz carrier frequency, 560MHz bandwidth transceiver has been designed employing 3D integration technology. An LSI integrated with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a small module size of 4.8mm × 4.8mm × 1.0mm. Since RF signals are degraded by parasitic capacitance associated with the low height and small footprint of the module, three design techniques are proposed in the paper. The module realizes the world's smallest size, and achieves sufficient transmitter modulation accuracy and receiver sensitivity, which meet TransferJet™ standards.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
