Packaging Solution for RF SiP with on-top Integrated Antenna

Abstract

Silicon based semiconductors are becoming a source of innovation in the field of RF solutions, especially involved in devices used in our everyday life. Wi-Fi and Bluetooth® connections adopted in home-networking, consumer platforms and wearable devices, together with the large spread of the IoT solutions, are more and more requiring very high levels in system integration. In particular, the focus on single-package Blue Tooth Low Energy (BTLE) system is increasing in the last few years. In this scenario, an innovative SiP (System in Package) solution with antenna integration on the top is considered as a possible and reliable alternative to SMD (Surface Mounted Device) antenna assembled on the package substrate. This paper will present a complex SiP composed by multiple stacked organic substrates, integrating a meander antenna that works in the Bluetooth® bandwidth. After describing the structure, the design methodology and the assembly strategy, a particular focus will be put on the antenna integration and dimensioning, supported by full-wave 3D electromagnetic simulations. The influence of the surrounding system on the antenna performance, and consequently the importance of co-design and co-simulation, will be emphasized.