Redundancy and ECC mechanisms to improve energy efficiency of on-die interconnects

A. Helmy, Alaa R. Alameldeen
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Abstract

We present a detailed analysis of the bandwidth requirements in a network-on-chip at high and low voltages. We propose mechanisms to maintain the functionality of a system-on-chip despite the presence of failures in the network-on-chip used to connect its components. Our mechanisms alleviate failures in the links and/or the connected buffers, and allow voltage scaling for the network. Our best mechanism allows reliable network operation well below 500 mV while reducing power by more than a factor of 5 and energy by 28% compared to a baseline without fault-tolerance mechanisms.
冗余和ECC机制,提高芯片上互连的能源效率
我们详细分析了片上网络在高电压和低电压下的带宽需求。我们提出了一种机制来维持片上系统的功能,尽管用于连接其组件的片上网络存在故障。我们的机制减轻了链路和/或连接缓冲区中的故障,并允许网络的电压缩放。我们的最佳机制允许可靠的网络运行远低于500 mV,同时与没有容错机制的基线相比,功率降低了5倍以上,能量降低了28%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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