Failure prediction and health prognostics of electronic components: A review

C. Bhargava, V. Banga, Y. Singh
{"title":"Failure prediction and health prognostics of electronic components: A review","authors":"C. Bhargava, V. Banga, Y. Singh","doi":"10.1109/RAECS.2014.6799572","DOIUrl":null,"url":null,"abstract":"The Rapid evolution of electronics device technology towards low cost and high performance, the electronics products become more complex, higher in density and speed, and lighter for easy portability. In modern competitive market, low cost and high performance are the key factors to attract the customers towards their products. Growing system complexity demands robust control to mitigate system control and disturbances. As more and more components are integrated on to a single chip, the probability of damage is increased, as the different components have different characteristics and different operating conditions. So a condition monitoring techniques are employed which embraces a knowledge of failure mechanism of individual part or integrated system, and diagnosis the health condition of a system in real time such that if it drifts from scheduled outcomes, an appropriate action to be taken before serious deterioration or breakdown occurs. The electronic system needs a fault prediction methodology to prevent the system from accidental failure and discrepancies. In this paper, different failure prediction methods have been discussed. For an efficient working of system, it is the prime requirement to analyze reliability prediction of electronic components along with life cycle costs.","PeriodicalId":229600,"journal":{"name":"2014 Recent Advances in Engineering and Computational Sciences (RAECS)","volume":"63 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-03-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 Recent Advances in Engineering and Computational Sciences (RAECS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RAECS.2014.6799572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 20

Abstract

The Rapid evolution of electronics device technology towards low cost and high performance, the electronics products become more complex, higher in density and speed, and lighter for easy portability. In modern competitive market, low cost and high performance are the key factors to attract the customers towards their products. Growing system complexity demands robust control to mitigate system control and disturbances. As more and more components are integrated on to a single chip, the probability of damage is increased, as the different components have different characteristics and different operating conditions. So a condition monitoring techniques are employed which embraces a knowledge of failure mechanism of individual part or integrated system, and diagnosis the health condition of a system in real time such that if it drifts from scheduled outcomes, an appropriate action to be taken before serious deterioration or breakdown occurs. The electronic system needs a fault prediction methodology to prevent the system from accidental failure and discrepancies. In this paper, different failure prediction methods have been discussed. For an efficient working of system, it is the prime requirement to analyze reliability prediction of electronic components along with life cycle costs.
电子元件失效预测与健康预测:综述
随着电子器件技术向低成本、高性能的方向快速发展,电子产品的结构越来越复杂,密度和速度越来越高,重量也越来越轻,便于携带。在现代竞争激烈的市场中,低成本和高性能是吸引顾客购买产品的关键因素。日益增长的系统复杂性要求鲁棒控制来减轻系统的控制和干扰。随着越来越多的部件集成到单个芯片上,由于不同的部件具有不同的特性和不同的工作条件,因此损坏的概率增加。因此,采用状态监测技术,了解单个部件或整体系统的故障机制,实时诊断系统的健康状况,以便在系统偏离预定结果时,在严重恶化或故障发生之前采取适当的措施。电子系统需要一种故障预测方法来防止系统的意外故障和偏差。本文讨论了不同的失效预测方法。为了保证系统的有效运行,对电子元器件的可靠性预测进行分析是电子元器件寿命周期成本分析的首要要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信