Design and Displacement Sensitivity Analysis of Micro scale Piezoresistive Cantilever

2022 Second International Conference on Advances in Electrical, Computing, Communication and Sustainable Technologies (ICAECT) Pub Date : 2022-04-21 DOI:10.1109/ICAECT54875.2022.9807951

Satyanarayana Talam, Dhruva Kollu, Shaik Haniff, Lokesh Pavan Nallamothu, Shaik Ayesha Begum, R. Busi

{"title":"Design and Displacement Sensitivity Analysis of Micro scale Piezoresistive Cantilever","authors":"Satyanarayana Talam, Dhruva Kollu, Shaik Haniff, Lokesh Pavan Nallamothu, Shaik Ayesha Begum, R. Busi","doi":"10.1109/ICAECT54875.2022.9807951","DOIUrl":null,"url":null,"abstract":"The present investigation is aimed at modelling of piezoresistive cantilever beam to evaluate the displacement by means of optimizing the dimensions, materials (p-silicon, Silicon carbide, Silicon) and the shape to realize the better performance. The optimized cantilever has been modelled with rectangular in shape by exploring the displacement through boundary load ranging from 20 to 100pa. Among three materials, the p-silicon has shown the maximum displacement than that of other materials under 40pa boundary load. The maximum displacement is observed 9.19x10-9μm and minimum displacement is -5.94x10-5μm respectively. From the analysis of all these results, the optimization will be carried only for the p-silicon material and getting the maximum displacement for the boundary loads of 40 Pa over the other materials. For implementing this, COMSOL Multiphysics software of version 5.0 is used.","PeriodicalId":346658,"journal":{"name":"2022 Second International Conference on Advances in Electrical, Computing, Communication and Sustainable Technologies (ICAECT)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-04-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 Second International Conference on Advances in Electrical, Computing, Communication and Sustainable Technologies (ICAECT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICAECT54875.2022.9807951","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

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Abstract

The present investigation is aimed at modelling of piezoresistive cantilever beam to evaluate the displacement by means of optimizing the dimensions, materials (p-silicon, Silicon carbide, Silicon) and the shape to realize the better performance. The optimized cantilever has been modelled with rectangular in shape by exploring the displacement through boundary load ranging from 20 to 100pa. Among three materials, the p-silicon has shown the maximum displacement than that of other materials under 40pa boundary load. The maximum displacement is observed 9.19x10-9μm and minimum displacement is -5.94x10-5μm respectively. From the analysis of all these results, the optimization will be carried only for the p-silicon material and getting the maximum displacement for the boundary loads of 40 Pa over the other materials. For implementing this, COMSOL Multiphysics software of version 5.0 is used.

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微尺度压阻悬臂梁设计及位移灵敏度分析

本研究旨在对压阻悬臂梁进行建模，通过优化尺寸、材料(p-硅、碳化硅、硅)和形状来评估位移，以实现更好的性能。优化后的悬臂梁在20 ~ 100pa边界荷载作用下的位移为矩形。在40pa边界载荷作用下，p-硅的位移比其他材料最大。最大位移为9.19x10-9μm，最小位移为-5.94x10-5μm。从所有这些结果的分析来看，只对p-硅材料进行优化，并在边界载荷为40 Pa时获得比其他材料的最大位移。为此，使用了COMSOL 5.0版本的Multiphysics软件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2022 Second International Conference on Advances in Electrical, Computing, Communication and Sustainable Technologies (ICAECT)

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