Study on Preparation and Application of Nano-copper Powder for Power Semiconductor Device Packaging

2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS) Pub Date : 2019-11-01 DOI:10.1109/SSLChinaIFWS49075.2019.9019790

Xu Pan, Ligen Wang, Fengcai Qi, Youzhi Zhou, Jiacheng Zhou, Jingguo Zhang, Zhaohui Zhao, Minghui Liang, H. Ye, Q. Hu, Hui-jun He, Limin Wang

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Abstract

Nano-copper powder is prepared by liquid phase reduction method in ethylene glycol solvent system. Nano-copper paste is prepared by mixing with organic carriers and subjected to pressureless sintering. The influence of different reducing agent systems on the particle size and morphology of nano-copper powder are studied. The sintering properties of the copper paste are tested by TEM, XRD and SEM. The results indicate that the synthesized product of using ethylene glycol as the reaction solvent and reducing agent is pure copper power and particle size from 100 nm to 200 nm at 160°C; The nano-copper paste can achieve metallurgical bonding at 300°C and the density of the sintered layer gradually increases with the sintering time prolonged, the porosity is gradually reduced, and the sintering of the nano-copper powder for 30 minutes is basically stable.

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功率半导体器件封装用纳米铜粉的制备及应用研究

在乙二醇溶剂体系中采用液相还原法制备了纳米铜粉。通过与有机载体混合，进行无压烧结制备纳米铜膏体。研究了不同还原剂体系对纳米铜粉粒度和形貌的影响。采用TEM、XRD和SEM对铜膏的烧结性能进行了测试。结果表明:以乙二醇为反应溶剂和还原剂，在160℃下合成的产物为纯铜粉，粒径为100 ~ 200 nm;纳米铜膏体在300℃下可实现冶金结合，烧结层密度随烧结时间的延长而逐渐增大，孔隙率逐渐降低，纳米铜粉烧结30分钟基本稳定。

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2019 16th China International Forum on Solid State Lighting & 2019 International Forum on Wide Bandgap Semiconductors China (SSLChina: IFWS)

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