Enhanced thermal management for future processors

2003 Symposium on VLSI Circuits. Digest of Technical Papers (IEEE Cat. No.03CH37408) Pub Date : 2003-06-12 DOI:10.1109/VLSIC.2003.1221202

M. Ma, S. Gunther, B. Greiner, N. Wolff, C. Deutschle, T. Arabi

引用次数: 18

Abstract

An enhanced thermal management mechanism that reduces power by scaling frequency and voltage in response to excessive temperatures is presented. The voltage transition process is done transparently to the execution of applications. The enhanced mechanism achieves an /spl sim/50% power reduction while limiting the performance impact to only /spl sim/20% for the duration of the thermal event. The approach allows the processor to meet its performance and reliability goals without additional thermal solution costs.

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增强未来处理器的热管理

提出了一种增强的热管理机制，通过调整频率和电压来响应过高的温度，从而降低功率。电压转换过程对应用程序的执行是透明的。增强的机制实现了/spl sim/50%的功耗降低，同时在热事件期间将性能影响限制在/spl sim/20%。该方法允许处理器满足其性能和可靠性目标，而无需额外的热解决方案成本。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2003 Symposium on VLSI Circuits. Digest of Technical Papers (IEEE Cat. No.03CH37408)

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