Modelling And Realization of a Compact CPW Transmission Lines Using 3D Mmics Technology in ADS Momentum

H. Bello, O. Oyeleke, A. D. Usman, T. Bello, Idris Muhammad, O. S. Zakariyya
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Abstract

The two dimensional monolithic microwave integrated circuits (2D MMIC) are mainly implemented in a planar fashion and use microstrip design based technology. At microwave frequency and above, they would require a large amount of passive circuitry therefore occupying a great deal of space (area). Furthermore the 2D MMIC is associated with some disadvantages ranging from the use of very thin substrate which makes it less reliable, to very delicate substrate due to the use of via-hole technology, coupling issue and high cost due to large area it occupies. To solve these problems a three-dimensional multilayer technique 3D MMIC was used. The design of the 3D MMIC is based on coplanar waveguide (CPW), in this design the signal is protected by the two grounds on both side, the circuit becomes more compact, cost-effective and with improved performance. This research work was aimed at the design, modelling and investigation of a GaAs based multilayer compact 3D MMIC transmission line. Different transmission lines were designed and modelled using Agilent’s Advanced Design System (ADS) and their Sparameters were extracted using Electromagnetic (EM) simulator momentum.
基于三维mimics技术的紧凑型CPW传输线的建模与实现
二维单片微波集成电路(2D MMIC)主要采用平面方式和基于微带设计技术实现。在微波频率及以上,它们将需要大量的无源电路,因此占用大量的空间(面积)。此外,2D MMIC具有一些缺点,从使用非常薄的衬底,使其不太可靠,到由于使用过孔技术而非常精致的衬底,耦合问题以及由于占地面积大而导致的高成本。为了解决这些问题,采用了三维多层技术3D MMIC。三维MMIC的设计基于共面波导(CPW),在该设计中,信号由两侧的两个接地保护,电路变得更加紧凑,成本效益高,性能也得到了提高。本研究工作旨在设计、建模和研究一种基于砷化镓的多层紧凑型三维MMIC传输线。利用安捷伦先进设计系统(ADS)对不同的输电线路进行了设计和建模,并利用电磁(EM)模拟器动量提取了输电线路的参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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