High frequency characterization of nanocomposite materials based on simulation and measurement of buried capacitors

Massar Wade, G. Duchamp, T. Dubois, I. B. Majek
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Abstract

Passive components embedded into printed circuit boards (PCBs) are of great interest to enhance the size reduction, the integration density increase and the number of functionalities of electronic circuits. This technology enables to increase the operating frequency towards higher frequencies and improve the reliability. A large number of passive components used on an electronic board are capacitive. So their study involves the biggest challenge for burying into PCBs due to the large range of capacitance required and the large frequency domain of applications. This paper deals with the high frequency characterization and the determination of the frequency dependence of the permittivity of innovative dielectric nanocomposite materials involved in capacitive structures, based on simulations and measurements.
基于埋地电容仿真与测量的纳米复合材料高频特性研究
无源元件嵌入到印刷电路板(pcb)中,对减小电子电路的尺寸、提高集成密度和增加电子电路的功能具有重要意义。该技术可以使工作频率向更高的频率增加,提高可靠性。电子电路板上使用的大量无源元件都是电容式的。因此,他们的研究涉及到埋入pcb的最大挑战,因为需要大范围的电容和大频域的应用。本文在模拟和测量的基础上,研究了电容结构中新型介电纳米复合材料的高频特性和介电常数的频率依赖性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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