Modeling methodology for predicting the thermo-mechanical reliability of electronic packaging

Abstract

A methodology for predicting the thermo-mechanical reliability of electronic packaging as a function of package design, material, and assembly process variables and environmental conditions is described. The methodology integrates finite element stress and strength analysis, experimental material constitutive and strength property measurement, experimental package stress and strength validation, and statistical design of experiment (DOE) and Monte Carlo analysis techniques. The results of extensive experimental and numerical evaluations demonstrating the stability and capability of the experimental and modeling techniques constituting the methodology are presented.