Automated Moisture Level Maintenance and Baking Process of Semiconductor Components

2022 International Conference on Electronics and Renewable Systems (ICEARS) Pub Date : 2022-03-16 DOI:10.1109/ICEARS53579.2022.9751916

Thillai Rani M, Sam Jebastin J, Sangesh V, Shemsingh Cyrus G

{"title":"Automated Moisture Level Maintenance and Baking Process of Semiconductor Components","authors":"Thillai Rani M, Sam Jebastin J, Sangesh V, Shemsingh Cyrus G","doi":"10.1109/ICEARS53579.2022.9751916","DOIUrl":null,"url":null,"abstract":"Printed circuit boards (PCBs) and semiconductor electronic components are often stored in a vacuum sealed moisture barrier bag. Further moisture protection is ensured with the use of humidity indicator cards and desiccant packs. The humidity indicator cards are manually checked, and the components are subjected to hot air drying based on the moisture level. In this paper, an automated approach is proposed for this process. The moisture content in the device is measured using moisture sensor and the microcontroller will initiate baking based on its input. If it is normal level the microcontroller will be in normal state, if it reaches the threshold, representing the presence of moisture, the microcontroller will provide instructions to dry the board or de vice using a hot air-drying oven at the required temperature based on the level of moisture. This helps in extending the shelf life by removal of moisture from the semiconductor de vice and enables effective utilization in production or storage line.","PeriodicalId":252961,"journal":{"name":"2022 International Conference on Electronics and Renewable Systems (ICEARS)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics and Renewable Systems (ICEARS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEARS53579.2022.9751916","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

Abstract

Printed circuit boards (PCBs) and semiconductor electronic components are often stored in a vacuum sealed moisture barrier bag. Further moisture protection is ensured with the use of humidity indicator cards and desiccant packs. The humidity indicator cards are manually checked, and the components are subjected to hot air drying based on the moisture level. In this paper, an automated approach is proposed for this process. The moisture content in the device is measured using moisture sensor and the microcontroller will initiate baking based on its input. If it is normal level the microcontroller will be in normal state, if it reaches the threshold, representing the presence of moisture, the microcontroller will provide instructions to dry the board or de vice using a hot air-drying oven at the required temperature based on the level of moisture. This helps in extending the shelf life by removal of moisture from the semiconductor de vice and enables effective utilization in production or storage line.

查看原文本刊更多论文

半导体元件的自动湿度维持和烘烤过程

印刷电路板(pcb)和半导体电子元件通常储存在真空密封防潮袋中。进一步的水分保护是确保使用湿度指示卡和干燥剂包。手动检查湿度指示卡，并根据湿度对部件进行热风干燥。本文提出了一种自动化的方法来实现这一过程。使用湿度传感器测量设备中的水分含量，微控制器将根据其输入启动烘烤。如果是正常水平，微控制器将处于正常状态，如果达到阈值，表示存在水分，微控制器将提供指示，使用热风烘箱在所需的温度下根据水分水平干燥板或设备。这有助于通过去除半导体器件中的水分来延长保质期，并使生产或存储线能够有效地利用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2022 International Conference on Electronics and Renewable Systems (ICEARS)

自引率

0.00%

发文量