Luminescent Ge nanocrystallites embedded in a-SiO2 films

Zhenhong He, Kunji Chen, Jun Xu, D. Feng, Hexiang Han, Zhao-ping Wang
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引用次数: 3

Abstract

The luminescent nanocrystal Ge embedded in a-SiO2 matrix was prepared by thermal oxidation of a-Si1-xGex:H films under conventional conditions. It was found that nc-Ge were formed through the selective oxidation of Si in a-GexSi1-x:H alloys and precipitation of Ge during oxidation. The average size of nc-Ge changed from 4 nm to 6 nm with the various conditions and Ge contents. Visible photoluminescence with peak energy 2.2 eV was observed from the oxidized samples where the nc-Ge have an average size of 4 nm. In order to control the size distribution of nc-Ge, we used multilayer films of a-Si:H/a-Si1-xGex:H instead of unlayered a-Si1-xGex:H alloy films to prepare nc-Ge embedded in SiO2 matrix. We found that the size of nc-Ge in perpendicular direction can be well confined by the SiO2 sublayers simultaneously formed.
镶嵌在a-SiO2薄膜中的发光锗纳米晶
在常规条件下,对a-Si1-xGex:H薄膜进行热氧化,制备了嵌入a-SiO2基体的发光纳米晶Ge。研究发现,在a-GexSi1-x:H合金中,通过选择性氧化Si和氧化过程中析出Ge,形成了nc-Ge。不同条件和Ge含量下,nc-Ge的平均粒径在4 ~ 6 nm之间变化。氧化后的纳米锗平均尺寸为4 nm,可见光致发光峰值能量为2.2 eV。为了控制nc-Ge的尺寸分布,我们采用a-Si:H/a-Si1-xGex:H多层膜代替非层状的a-Si1-xGex:H合金膜制备了嵌入SiO2基体的nc-Ge。同时形成的SiO2亚层可以很好地限制垂直方向上nc-Ge的大小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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