Commercial Production of Low-k PZT film using Sputtering Method

M. Kiuchi, Ryoma Miyake, S. Yoshida, Shuji Tanaka, Tsuyoshi Takemoto, Y. Yamaguchi, K. Komaki
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Abstract

Monocrystalline-like epitaxial PZT films for commercial use are described for piezoelectric MEMS applications. The composition ratios of Zr and Ti in the films are Morphotropic phase boundary (52:48) and Ti rich (42:58). The films with a thickness of 1 μm to 2 μm exhibit typical transverse piezoelectric d31 coefficients of -185 pm/V and -149 pm/V, respectively. Relative dielectric permittivities are 430 and 264. Dielectric losses are 0.015 and 0.020. Both of films of figure-of-merit for MEMS device are more than 50 GPa. These films are commercially available for piezoelectric MEMS device development and production.
用溅射法生产低钾PZT薄膜
描述了用于压电MEMS应用的商业用途的单晶样外延PZT薄膜。薄膜中Zr和Ti的组成比分别为亲形相(52:48)和富Ti(42:58)。厚度为1 ~ 2 μm的薄膜表现出典型的横向压电d31系数,分别为-185 pm/V和-149 pm/V。相对介电常数为430和264。介电损耗为0.015和0.020。两种薄膜的MEMS器件的品质因数均大于50gpa。这些薄膜可用于压电MEMS器件的开发和生产。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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