Processing Techniques with Heating Conditions for Multiferroic Systems of BiFeO3, BaTiO3, PbTiO3, CaTiO3 Thin Films

Kuldeep Chand Verma, Manpreet Singh
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Abstract

In this chapter, we have report a list of synthesis methods (including both synthesis steps & heating conditions) used for thin film fabrication of perovskite ABO3 (BiFeO3, BaTiO3, PbTiO3 and CaTiO3) based multiferroics (in both single-phase and composite materials). The processing of high quality multiferroic thin film have some features like epitaxial strain, physical phenomenon at atomic-level, interfacial coupling parameters to enhance device performance. Since these multiferroic thin films have ME properties such as electrical (dielectric, magnetoelectric coefficient & MC) and magnetic (ferromagnetic, magnetic susceptibility etc.) are heat sensitive, i.e. ME response at low as well as higher temperature might to enhance the device performance respect with long range ordering. The magnetoelectric coupling between ferromagnetism and ferroelectricity in multiferroic becomes suitable in the application of spintronics, memory and logic devices, and microelectronic memory or piezoelectric devices. In comparison with bulk multiferroic, the fabrication of multiferroic thin film with different structural geometries on substrate has reducible clamping effect. A brief procedure for multiferroic thin film fabrication in terms of their thermal conditions (temperature for film processing and annealing for crystallization) are described. Each synthesis methods have its own characteristic phenomenon in terms of film thickness, defects formation, crack free film, density, chip size, easier steps and availability etc. been described. A brief study towards phase structure and ME coupling for each multiferroic system of BiFeO3, BaTiO3, PbTiO3 and CaTiO3 is shown.
BiFeO3, BaTiO3, PbTiO3, CaTiO3薄膜多铁系统的加热加工技术
在本章中,我们报告了用于制备钙钛矿ABO3 (BiFeO3, BaTiO3, PbTiO3和CaTiO3)基多铁质(单相和复合材料)薄膜的合成方法列表(包括合成步骤和加热条件)。高质量多铁性薄膜的加工需要具备外延应变、原子级物理现象、界面耦合参数等特征,以提高器件性能。由于这些多铁性薄膜具有ME特性,如电(介电、磁电系数& MC)和磁(铁磁性、磁化率等)是热敏性的,即在低温度和高温度下的ME响应可能会提高器件性能方面的长程有序。多铁磁性材料中铁磁性和铁电性之间的磁电耦合特性适合于自旋电子学、存储和逻辑器件、微电子存储或压电器件的应用。与块体多铁性相比,在衬底上制备不同几何结构的多铁性薄膜具有可减小的夹紧效应。从热条件(薄膜加工温度和结晶退火温度)的角度描述了制备多铁薄膜的简单过程。每种合成方法在薄膜厚度、缺陷形成、无裂纹薄膜、密度、芯片尺寸、容易步骤和可获得性等方面都有自己的特点。本文对BiFeO3、BaTiO3、PbTiO3和CaTiO3各多铁体系的相结构和ME耦合进行了简要的研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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