Small pixel pitch MCT IR-modules

H. Lutz, R. Breiter, D. Eich, H. Figgemeier, P. Fries, S. Rutzinger, J. Wendler
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引用次数: 11

Abstract

It is only some years ago, since VGA format detectors in 15μm pitch, manufactured with AIM’s MCT n-on-p LPE standard technology, have been introduced to replace TV/4 format detector arrays as a system upgrade. In recent years a rapid increase in the demand for higher resolution, while preserving high thermal resolution, compactness and low power budget is observed. To satisfy these needs AIM has realized first prototypes of MWIR XGA format (1024x768) detector arrays in 10μm pitch. They fit in the same compact dewar as 640x512, 15μm pitch detector arrays. Therefore, they are best suited for system upgrade purposes to benefit from higher spatial resolution and keep cost on system level low. By combining pitch size reduction with recent development progress in the fields of miniature cryocoolers, short dewars and high operating temperatures the way ahead to ultra-compact high performance MWIR-modules is prepared. For cost reduction MBE grown MCT on commercially available GaAs substrates is introduced at AIM. Recently, 640x512, 15μm pitch FPAs, grown with MBE have successfully passed long-term high temperature storage tests as a crucial step towards serial production readiness level for use in future products. Pitch size reduction is not limited to arrays sensitive in the MWIR, but is of great interest for high performance LWIR or 3rd Gen solutions. Some applications such as rotorcraft pilotage require superior spatial resolution in a compact design to master severe weather conditions or degraded visual environment such as brown-out. For these applications AIM is developing both LWIR as well as dual band detector arrays in HD-format (1280x720) with 12μm pitch. This paper will present latest results in the development of detector arrays with small pitch sizes of 10μm and 12μm at AIM, together with their usage to realize compact cooled IR-modules.
小像素间距MCT红外模块
仅在几年前,采用AIM的MCT n-on-p LPE标准技术制造的15μm间距VGA格式检测器已被引入以取代TV/4格式检测器阵列作为系统升级。近年来,在保持高热分辨率、紧凑性和低功耗预算的同时,对更高分辨率的需求迅速增加。为了满足这些需求,AIM已经实现了10μm间距MWIR XGA格式(1024x768)探测器阵列的首批原型。它们适合与640x512, 15μm间距探测器阵列相同的紧凑型杜瓦瓶。因此,它们最适合用于系统升级目的,以从更高的空间分辨率中获益,并将成本保持在较低的系统级别。通过将节距减小与微型制冷机、短杜瓦和高温领域的最新发展进展相结合,为超小型高性能mwir模块的发展铺平了道路。为了降低成本,在市售的GaAs衬底上引入了MBE生长的MCT。最近,使用MBE生长的640x512、15μm间距fpa成功通过了长期高温存储测试,这是迈向未来产品批量生产准备水平的关键一步。节距减小不仅限于在MWIR中敏感的阵列,而且对高性能LWIR或第三代解决方案非常感兴趣。一些应用,如旋翼机引航,需要在一个紧凑的设计优越的空间分辨率,以掌握恶劣的天气条件或退化的视觉环境,如停电。针对这些应用,AIM正在开发12μm间距的高清格式(1280x720) LWIR和双波段探测器阵列。本文将介绍在AIM下10μm和12μm小间距探测器阵列的最新发展成果,以及它们在实现紧凑冷却红外模块中的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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