{"title":"GaN-Based Micro-LEDs and its Applications","authors":"Zhaojun Liu, C. Qiu, Xiaowei Sun","doi":"10.1364/ACPC.2017.SU2C.6","DOIUrl":null,"url":null,"abstract":"In this report, we will introduce the design and fabrication of GaN-based active matrix Micro-LEDs by integrating Micro-LED arrays on Si backplane using fine-pitch flip-chip bonding process. Applications for advanced displays and communications will also be discussed.","PeriodicalId":285199,"journal":{"name":"2017 Asia Communications and Photonics Conference (ACP)","volume":"266 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-11-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 Asia Communications and Photonics Conference (ACP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/ACPC.2017.SU2C.6","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
In this report, we will introduce the design and fabrication of GaN-based active matrix Micro-LEDs by integrating Micro-LED arrays on Si backplane using fine-pitch flip-chip bonding process. Applications for advanced displays and communications will also be discussed.