Electro-optical sensor packaging overview

T. Li
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Abstract

This paper emphasizes the infrared sensor/detector packaging. Electro-optical (E-O) sensor packaging is a challenging task. By its nature, it requires one to complete two missions: 1) to expose the sensing element in order to interact with the environment "transparently" while detecting the surrounding and 2) to protect sensitive electronics from the harsh environment.
光电传感器封装概述
本文重点研究了红外传感器/探测器的封装。光电(E-O)传感器封装是一项具有挑战性的任务。就其性质而言,它需要完成两个任务:1)暴露传感元件,以便在检测周围环境时“透明”地与环境相互作用;2)保护敏感电子设备免受恶劣环境的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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