Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Pub Date : 1900-01-01 DOI:10.1109/IPFA.2003.1222709

Alastair Trigg, Daniel Chan, John Thong

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Abstract

The following topics were dealt: Failure analysis I; reliability and failure analysis in specialist devices; failure analysis II; advanced interconnects I; failure analysis III; packaging related failure mechanisms; advanced interconnects; dielectrics and hot carrier reliability I; dielectrics and hot carrier reliability II; EOS/ESD and CMOS latchup; failure analysis IV; failure analysis V.

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第十届集成电路物理与失效分析国际研讨会论文集。IPFA 2003

讨论了以下主题:失效分析I;专业设备的可靠性和失效分析;失效分析II;高级互连I;失效分析III;包装相关失效机制;先进的互联;电介质和热载流子可靠性I;电介质和热载流子可靠性II;EOS/ESD和CMOS锁存;故障分析IV;故障分析;

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

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