Analysis and Simulation of temperature-current rise in modern PCB traces

Proceedings of IEEE East-West Design & Test Symposium (EWDTS 2014) Pub Date : 2014-09-01 DOI:10.1109/EWDTS.2014.7027054

K. Petrosyants, A. Kortunov, I. Kharitonov, A. Popov, Natalya Gomanilova, N. I. Rjabov

引用次数: 3

Abstract

The temperature-current rise in modern (up to 100-150 microns wide) PCB traces is simulated using three software tools ANSYS, HyperLynxThermal and ELCUT. The results are compared with the IR measurements in PCB copper traces with different sizes and substrate materials. It is shown that ANSYS correctly describes the thermal behavior for all tests, other tools have some limitations for small size traces.

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现代PCB走线温度电流上升的分析与仿真

使用三个软件工具ANSYS, HyperLynxThermal和ELCUT模拟现代(高达100-150微米宽)PCB走线的温度电流上升。结果与不同尺寸和衬底材料的PCB铜线的红外测量结果进行了比较。结果表明，ANSYS能够正确地描述所有试验的热行为，而其他工具对于小尺寸轨迹存在一定的局限性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of IEEE East-West Design & Test Symposium (EWDTS 2014)

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