Packaging Technology for the Improvement of Power Cycling Capability of HVIGBTs

Abstract

Power cycling capability is one of the major reliability topics of IGBT modules. Therefore, the packaging technology for the improvement of power cycling capability is described in the paper. Bond-wire lift off, due to the mismatch between silicon (Si) and aluminum (A1) bond wire, is well-known failure root cause of power-cycling fatigue [1]. Therefore, the improved bond wire technology was introduced [2]. However, it is not enough just to improve wire bonding technology because increased operating temperature brings additional stress on other materials. In addition to bond wire technology, three components and their impact are described in this paper: silicone gel material, solder material and metallization material of the ceramic. Finally, the improvement with the combination of all established technologies is confirmed.