A 60GHz Phased Array Transceiver Chipset in 45nm RF SOI Featuring Channel Aggregation Using HRM-Based Frequency Interleaving

Armagan Dascurcu, Sohail Ahasan, Ali Binaie, Kuei Jih Lu, A. Natarajan, H. Krishnaswamy
{"title":"A 60GHz Phased Array Transceiver Chipset in 45nm RF SOI Featuring Channel Aggregation Using HRM-Based Frequency Interleaving","authors":"Armagan Dascurcu, Sohail Ahasan, Ali Binaie, Kuei Jih Lu, A. Natarajan, H. Krishnaswamy","doi":"10.1109/RFIC54546.2022.9863112","DOIUrl":null,"url":null,"abstract":"Channel aggregation at mm-wave enables extremely high data rates, but necessitates high-speed data converters. This paper presents an alternative approach leveraging HRM-based frequency interleaving (FI), which relaxes the requirements on the data converters, reducing their power consumption and cost. The implemented 45nm RF SOI chipset includes 4-element 60GHz phased-array RX and TX chips, and 4-channel TX and RX baseband (BB) FI channelizer chips, which channelize 8GHz of bandwidth (BW) over 59–67 G Hz into 4 channels. Measured link results indicate that the BB FI channelizers and 60GHz phased array ICs together achieve sufficient SNDR in each channel to support 16-QAM and 64-QAM modulations over wide bandwidths, enabling wireless links at 32Gbps and beyond.","PeriodicalId":415294,"journal":{"name":"2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)","volume":"50 4","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIC54546.2022.9863112","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

Channel aggregation at mm-wave enables extremely high data rates, but necessitates high-speed data converters. This paper presents an alternative approach leveraging HRM-based frequency interleaving (FI), which relaxes the requirements on the data converters, reducing their power consumption and cost. The implemented 45nm RF SOI chipset includes 4-element 60GHz phased-array RX and TX chips, and 4-channel TX and RX baseband (BB) FI channelizer chips, which channelize 8GHz of bandwidth (BW) over 59–67 G Hz into 4 channels. Measured link results indicate that the BB FI channelizers and 60GHz phased array ICs together achieve sufficient SNDR in each channel to support 16-QAM and 64-QAM modulations over wide bandwidths, enabling wireless links at 32Gbps and beyond.
45nm射频SOI中60GHz相控阵收发器芯片组,采用基于hrm的频率交错技术实现信道聚合
毫米波的信道聚合可以实现极高的数据速率,但需要高速数据转换器。本文提出了一种利用基于hrm的频率交织(FI)的替代方法,该方法放宽了对数据转换器的要求,降低了它们的功耗和成本。实现的45nm RF SOI芯片组包括4元60GHz相控阵RX和TX芯片,以及4通道TX和RX基带(BB) FI信道化芯片,可将59 - 67g Hz以上的8GHz带宽(BW)信道化为4个通道。链路测量结果表明,BB FI信道器和60GHz相控阵集成电路在每个信道中共同实现足够的SNDR,以支持宽带上的16-QAM和64-QAM调制,从而实现32Gbps及以上的无线链路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信