Armagan Dascurcu, Sohail Ahasan, Ali Binaie, Kuei Jih Lu, A. Natarajan, H. Krishnaswamy
{"title":"A 60GHz Phased Array Transceiver Chipset in 45nm RF SOI Featuring Channel Aggregation Using HRM-Based Frequency Interleaving","authors":"Armagan Dascurcu, Sohail Ahasan, Ali Binaie, Kuei Jih Lu, A. Natarajan, H. Krishnaswamy","doi":"10.1109/RFIC54546.2022.9863112","DOIUrl":null,"url":null,"abstract":"Channel aggregation at mm-wave enables extremely high data rates, but necessitates high-speed data converters. This paper presents an alternative approach leveraging HRM-based frequency interleaving (FI), which relaxes the requirements on the data converters, reducing their power consumption and cost. The implemented 45nm RF SOI chipset includes 4-element 60GHz phased-array RX and TX chips, and 4-channel TX and RX baseband (BB) FI channelizer chips, which channelize 8GHz of bandwidth (BW) over 59–67 G Hz into 4 channels. Measured link results indicate that the BB FI channelizers and 60GHz phased array ICs together achieve sufficient SNDR in each channel to support 16-QAM and 64-QAM modulations over wide bandwidths, enabling wireless links at 32Gbps and beyond.","PeriodicalId":415294,"journal":{"name":"2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)","volume":"50 4","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RFIC54546.2022.9863112","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Channel aggregation at mm-wave enables extremely high data rates, but necessitates high-speed data converters. This paper presents an alternative approach leveraging HRM-based frequency interleaving (FI), which relaxes the requirements on the data converters, reducing their power consumption and cost. The implemented 45nm RF SOI chipset includes 4-element 60GHz phased-array RX and TX chips, and 4-channel TX and RX baseband (BB) FI channelizer chips, which channelize 8GHz of bandwidth (BW) over 59–67 G Hz into 4 channels. Measured link results indicate that the BB FI channelizers and 60GHz phased array ICs together achieve sufficient SNDR in each channel to support 16-QAM and 64-QAM modulations over wide bandwidths, enabling wireless links at 32Gbps and beyond.