A low loss self-packaged quasi-lumped-element high pass filter using SISL technology

Zonglin Ma, Kaixue Ma, F. Meng
{"title":"A low loss self-packaged quasi-lumped-element high pass filter using SISL technology","authors":"Zonglin Ma, Kaixue Ma, F. Meng","doi":"10.1109/GSMM.2017.7970304","DOIUrl":null,"url":null,"abstract":"This paper presents a low loss self-packaged quasi-lumped-element high pass filter (HPF) based on substrate integrated suspended line (SISL) technology. The HPF is composed of double metal layer spiral inductors and interdigital capacitors. And the dielectric loss for the filter elements is further reduced through hollowing the support substrate. The HPF also has advantages of self-packaging, low loss, compact size, and low cost by using SISL technology.","PeriodicalId":414423,"journal":{"name":"2017 10th Global Symposium on Millimeter-Waves","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 10th Global Symposium on Millimeter-Waves","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GSMM.2017.7970304","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

This paper presents a low loss self-packaged quasi-lumped-element high pass filter (HPF) based on substrate integrated suspended line (SISL) technology. The HPF is composed of double metal layer spiral inductors and interdigital capacitors. And the dielectric loss for the filter elements is further reduced through hollowing the support substrate. The HPF also has advantages of self-packaging, low loss, compact size, and low cost by using SISL technology.
采用SISL技术的低损耗自封装准集总元高通滤波器
提出了一种基于衬底集成悬浮线(SISL)技术的低损耗自封装准集总元高通滤波器。该滤波器由双金属层螺旋电感和数字间电容组成。并且通过掏空支撑基板进一步降低滤波器元件的介电损耗。此外,采用SISL技术的HPF具有自封装、低损耗、体积小、成本低等优点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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