Dielectric properties of materials at cryogenic temperatures and microwave frequencies

R. Geyer, J. Krupka
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引用次数: 7

Abstract

The permittivity and dielectric loss tangent of single-crystal quartz, cross-linked polystyrene (Rexolite), and polytetrafluoroethylene (Teflon) were measured at microwave frequencies and at temperatures of 77 K and 300 K using a dielectric resonator technique. Application of high-temperature superconducting (HTS) films as the endplates of the dielectric resonator made it possible to determine dielectric loss tangents of about 7/spl times/10/sup 6/ at 77 K. Two permittivity tensor components for uniaxially anisotropic crystalline quartz were measured. Although the permittivities at 77 K changed very little from their room temperature values at 300 K, large changes in dielectric losses were observed. The decreased loss characteristics of these microelectronic substrates can markedly improve the performance of many microwave devices at cryogenic temperatures.<>
材料在低温和微波频率下的介电特性
利用介电谐振器技术测量了单晶石英、交联聚苯乙烯(Rexolite)和聚四氟乙烯(Teflon)在微波频率和77 K和300 K温度下的介电常数和介电损耗正切。高温超导(HTS)薄膜作为介质谐振器的端板,可以在77 K时测定约7/spl倍/10/sup 6/的介质损耗切线。测量了单轴各向异性晶体石英的两个介电常数张量分量。虽然77 K时的介电常数与300 K时的室温值相比变化很小,但介质损耗却发生了很大变化。这些微电子衬底损耗特性的降低可以显著改善许多微波器件在低温下的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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