High Speed High Density Poly I2L

ESSCIRC 80: 6th European Solid State Circuits Conference Pub Date : 1980-09-01 DOI:10.1109/ESSCIRC.1980.5468774

Mohamed H. Elsaid, Ali M. Hashed

引用次数: 0

Abstract

A new poly I2L structure with switching speed three times higher than that of the conventional I2L structure is presented. The packing density is also improved by a factor of two using this new structure.

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高速高密度聚I2L

提出了一种开关速度比传统I2L结构快3倍的新型多晶硅结构。采用这种新结构，填料密度也提高了两倍。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

ESSCIRC 80: 6th European Solid State Circuits Conference

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