Embedding Fault List Compression techniques in a design automation framework for analog and Mixed-Signal structural testing

R. Martins, N. Lourenço, N. Horta, N. Guerreiro, Marcelino B. Santos
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引用次数: 6

Abstract

The innovative work “Analogue and Mixed-Signal Production Test Speed-Up by Means of Fault List Compression” [1] focuses on the prohibitive number of structural faults which need to be simulated, at circuit-level, in the design environment. It proposes a fault list compression technique by defining a stratified fault list, build with a set of “representative” faults, one per stratum. The methodology allows different tradeoffs between fault list compression and fault representation accuracy by changing the number of strata, L. These concepts are embed them in the AIDA's framework [2][3], which is an analog IC design automation environment, and, allows the designer to select a circuit sizing and determine an efficient set of stimuli for fault detection, reducing the simulations required in the test environment. A single ended 2-stage amplifier is used here to demonstrate the proposed developments in the field of structural testing. All the results are presented for the United Microelectronics Corporation (UMC) 130 nanometers technology node.
在模拟和混合信号结构测试的设计自动化框架中嵌入故障表压缩技术
创新工作“通过故障列表压缩加速模拟和混合信号产生测试”[1]关注的是在设计环境中需要在电路级模拟的大量结构故障。它提出了一种断层表压缩技术,通过定义分层断层表,用一组“代表性”断层构建断层表,每层一个。该方法允许通过改变层数l在故障列表压缩和故障表示精度之间进行不同的权衡。这些概念被嵌入AIDA的框架[2][3],这是一个模拟IC设计自动化环境,并且允许设计人员选择电路尺寸并确定一组有效的故障检测刺激,减少测试环境中所需的模拟。这里使用一个单端2级放大器来演示结构测试领域的拟议发展。所有结果都是针对联合微电子公司(UMC) 130纳米技术节点提出的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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