Device-Level Performance Comparison of Some Pocket Engineered III-V/Si Hetero-Junction Vertical Tunnel Field Effect Transistor

M. Tripathy, Ashish Kumar Singh, S. Chander, P. Singh, K. Baral, S. Jit
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引用次数: 7

Abstract

This work reports a comparative study of vertically grown III-V/Si heterojunction based n-type tunnel field effect transistor (TFET) architectures: GaSb/Si heterojunction vertical TFET with source pocket and InAs/Si heterojunction vertical TFET with source pocket. For the first time GaSb/Si heterojunction based vertical TFET is proposed here whereas InAs/Si based heterojunction TFET is well explored in literature. Low band gap semiconductor like InAs and GaSb are considered in source region of TFET to reduce the tunneling width for enhancing ON-current. Source pocket is adopted to enhance the sub-threshold performance of the devices. Performance comparison is done in terms of different dc parameters like average sub-threshold swing (SS), ION, IOFF, threshold voltage (VT) and ION/IOFF ratio of the TFETs presented for study. In addition to this, the intrinsic capacitance like CGD and temperature reliability studies are done for both the devices presented for study.
几种口袋工程III-V/Si异质结垂直隧道场效应晶体管的器件级性能比较
本文报道了基于III-V/Si异质结的n型隧道场效应晶体管(TFET)结构的比较研究:带源口袋的GaSb/Si异质结垂直TFET和带源口袋的InAs/Si异质结垂直TFET。本文首次提出了基于GaSb/Si异质结的垂直TFET,而基于InAs/Si异质结的TFET在文献中已经得到了很好的研究。在TFET的源区考虑低带隙半导体如InAs和GaSb,以减小隧道宽度以增强导通电流。采用源袋增强器件的亚阈值性能。根据不同的直流参数,如平均亚阈值摆幅(SS)、离子、IOFF、阈值电压(VT)和离子/IOFF比,对研究的tfet进行了性能比较。除此之外,本文还对两种器件进行了本征电容如CGD和温度可靠性的研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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