In-body wireline interfacing platform for multi-module implantable microsystems

Abstract

The recent evolution of implantable medical devices from single-unit stimulators to modern implantable microsystems, has driven the need for distributed technologies, in which both the implant system and functions are partitioned across multiple active devices. This multi-module approach is made possible thanks to novel network architectures, allowing for in-body power and data communications to be performed using implantable leads. This paper discusses the challenges in implementing such interfacing system and presents a platform based on one central implant (CI) and multiple peripheral implants (PIs) using a custom 4WiCS communication protocol. This is implemented in PCB technology and tested to demonstrate intrabody communication capabilities and power transfer within the network. Measured results show CI-to-PI power delivery achieves 70 % efficiency in expected load condition, while establishing full-duplex data link with up to 4 PIs simultaneously.