Signal integrity aware TSV positioning

Abstract

In this paper, a signal integrity aware TSV positioning method (SITP) is introduced. Grounded TSV proved to help eliminating TSV-to-TSV coupling. A trench based 3D IC placement method is developed, transforming 2D placement into 3D placement and perform signal TSV placement with flexible grounded TSV Insertion. IBM placement benchmark is used for original 2D placement. By evaluating wire-length and runtime, SITP automatically achieve high performance 3D IC placement with considerable TSV-TSV interference elimination.