3.2Tb/s Heterogeneous Photonic Integrated Circuit Chip in a Co-Packaged Optics Configuration

Abstract

We present a low-cost, scalable 3.2Tbps heterogenous photonic integrated circuit chip assembled in a co-packaged optics configuration. The integration of III-V material directly into the Silicon-Photonic chip offers clear form-factor, density, and thermal dissipation advantages.