{"title":"Fast deposition of /spl mu/c-Si:H films from Ar-diluted SiH/sub 4/ plasma in RF glow discharge","authors":"D. Das, M. Jana, A. K. Barua","doi":"10.1109/PVSC.2000.916012","DOIUrl":null,"url":null,"abstract":"Using Ar as diluent for SiH/sub 4/ in RF glow discharge, we obtained undoped and doped /spl mu/c-Si:H films having high /spl sigma//sub D/ low /spl Delta/E and low /spl alpha/; exhibiting sharp crystallographic rings in the electron diffraction pattern, c-Si grains of 100 /spl Aring/ diameter in the micrograph and intense Raman peak around 520 cm/sup -1/. The films were prepared at a remarkably high deposition rate of 50-70 /spl Aring//min contributed from SiH/sub 4/ having a flow rate of 1 SCCM, and hence it provides enormous promise towards an economic throughput in the fabrication of devices using this material.","PeriodicalId":139803,"journal":{"name":"Conference Record of the Twenty-Eighth IEEE Photovoltaic Specialists Conference - 2000 (Cat. No.00CH37036)","volume":"21 11","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Record of the Twenty-Eighth IEEE Photovoltaic Specialists Conference - 2000 (Cat. No.00CH37036)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PVSC.2000.916012","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Using Ar as diluent for SiH/sub 4/ in RF glow discharge, we obtained undoped and doped /spl mu/c-Si:H films having high /spl sigma//sub D/ low /spl Delta/E and low /spl alpha/; exhibiting sharp crystallographic rings in the electron diffraction pattern, c-Si grains of 100 /spl Aring/ diameter in the micrograph and intense Raman peak around 520 cm/sup -1/. The films were prepared at a remarkably high deposition rate of 50-70 /spl Aring//min contributed from SiH/sub 4/ having a flow rate of 1 SCCM, and hence it provides enormous promise towards an economic throughput in the fabrication of devices using this material.