Investigation of reliability of EMC and SMC on reflectance for UV LED applications

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2016-04-18 DOI:10.1109/EUROSIME.2016.7463398

X. Qiu, J. Lo, Andrew W. Shang, S. Lee

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引用次数: 6

Abstract

Conventional packaging materials for light-emitting diodes (LED) are susceptible to UV radiation and high temperature. Therefore, for developing UV LED packages, new materials with better UV and high temperature resistance are required. There are two candidates, namely, epoxy molding compound (EMC) and silicone molding compound (SMC), being considered by the industry. This paper focuses on the change in reflectance of EMC and SMC over time as a measure of reliability. Aging was performed on EMC and SMC culls under high temperature, and combination of UV exposure and high temperature simultaneously. Reflectance of EMC and SMC culls before and after aging were compared. It was concluded that both EMC and SMC degrade under simultaneous UV radiation and high temperature aging, and that SMC is more UV and thermally resistant than EMC based on change in reflectance, surface morphology, and roughness.

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UV LED应用中电磁兼容和SMC对反射率的可靠性研究

传统的发光二极管封装材料易受紫外线辐射和高温的影响。因此，为了开发UV LED封装，需要具有更好的抗紫外线和耐高温性能的新材料。目前业界正在考虑两种候选材料，即环氧树脂模塑复合材料(EMC)和硅树脂模塑复合材料(SMC)。本文重点研究了电磁兼容和SMC的反射率随时间的变化，以此作为可靠性的衡量标准。对EMC和SMC选材进行高温老化，以及紫外线和高温同时老化。比较了老化前后EMC和SMC选材的反射率。结果表明，在紫外线辐射和高温老化同时发生的情况下，EMC和SMC都会发生降解，从反射率、表面形貌和粗糙度的变化来看，SMC比EMC更耐紫外线和耐热。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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