High Quality Laser Dicing of Semiconductor Package with a Single-mode Q-switched Fiber Laser

Abstract

Recently, the laser dicing has been expected as a new dicing method because of its high flexibility. However, the reduction of heat affected zone is strongly required in order to prevent the deterioration of semiconductor devices due to heat damage. From this point of view, high quality dicing method for semiconductor package by a single-mode Q-switched fiber laser was experimentally investigated using cooled assist gas for reducing the heat affected zone. It is clarified that the combination of nitrogen assist gas in the coaxial direction of laser beam and cooled assist gas from the rear side of cutting direction led to the better cutting results with low heat affected zone.