A Wideband Millimeter Wave E-shape Antenna in Package with Embedded Wafer Level Ball Grid Array Technology

Abstract

The feasibility of an antenna-in-package (AiP) concept is demonstrated for automotive radar sensors at the 77 GHz-band. Infineon’s embedded wafer level ball grid array (eWLB) is employed as packaging technology. We developed a E-shape patch antenna in 6×6 mm2 eWLB package that include 2×2 mm2 dummy Si chips. From the simulated results of the proposed E-plane patch antenna, provides a wide bandwidth of 19.2% (|S11|<-10dB) and has a relatively stable high gain varying from 6.1 to 7.8 dBi. The demonstrator result of these embedded radar sensors show an excellent system performance at a high integration level.