Simulation and Research of the PCB Vias Effects

Abstract

Through-hole vias is the essential element of modern multilayer PCB to connect the signal paths, power planes and ground planes on different layers of the board. The via in the signal path results in the discontinuity and a possible source of signal degradation and EMI. This paper presents the 3D Transmission-Line Modelling(TLM) method to model the vias and PCB trace and simulate the signal transmission process. The aim is to forecast the signal degradation by means of comparing the pulses propagation in the microstrip traces with and without via.