Journal of Failure Analysis and Prevention

Incorporating Time-Domain Reflectometry in Chip-Level Failure Analysis Workflow: Case Studies and Development for Volume Failure Analysis

Pub Date : 2024-08-10 DOI: 10.1007/s11668-024-01968-w Joy Y. Liao, Timothy Pham, Khánh Giang, Howard Lee Marks, Thomas White, Jesse Alton, Brett Gibson, M. Igarashi

Assessing Electronics with Advanced 3D X-ray Imaging Techniques, Nanoscale Tomography, and Deep Learning

Pub Date : 2024-08-09 DOI: 10.1007/s11668-024-01989-5 H. Villarraga-Gómez, Kyle Crosby, Masako Terada, M. Rad

Enhanced Infrared Imaging for Die-Level Fault Isolation Using Lock-In Thermography

Pub Date : 2024-08-09 DOI: 10.1007/s11668-024-02000-x Anjanashree M. R. Sharma, Kristof J. P. Jacobs, David Coenen, Ingrid De Wolf