Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.

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Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006. - 最新文献

Fracture mechanical life-time investigation of glass frit-bonded sensors

Pub Date : 2006-07-05 DOI: 10.1109/ITHERM.2006.1645501 M. Petzold, C. Dresbach, M. Ebert, J. Bagdahn, M. Wiemer, K. Glien, J. Graf, R. Muller-Fiedler, H. Hofer

Accelerated Active High-Temperature Cycling Test for Power MOSFETs

Pub Date : 2006-07-05 DOI: 10.1109/ITHERM.2006.1645468 R. Schacht, B. Wunderle, E. Auerswald, B. Michel, H. Reichl

Optimization of packaging materials and design for thermal management in stacked-die packages

Pub Date : 2006-07-05 DOI: 10.1109/ITHERM.2006.1645485 S. Moon, M. Dizon, C. Chiu, E. García

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