2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - 最新文献

IR pulse thermography as failure analytical tool applied to die attach processes

Pub Date : 2015-09-01 DOI: 10.1109/THERMINIC.2015.7389622 D. May, S. Fritzsche, A. Cardoso, R. Schacht, B. Wunderle

Effect of the trench depth on the linear mode capability of trench technology MOSFET-s

Pub Date : 2015-09-01 DOI: 10.1109/THERMINIC.2015.7389634 Szilard Jamborhazi, A. Czett, M. Rencz

"LaTIMA" an innovative test stand for thermal and electrical characterization of highly conductive metals, die attach, and substrate materials

Pub Date : 2015-09-01 DOI: 10.1109/THERMINIC.2015.7389630 M. A. Ras, D. May, R. Schacht, M. Bast, R. Eisele, B. Michel, T. Winkler, R. Rzepka, B. Wunderle

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