2006 International Interconnect Technology Conference

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2006 International Interconnect Technology Conference - 最新文献

Highly Reliable Interface of Self-aligned CuSiN process with Low-k Sic barrier dielectric (k3.5) for 65nm node and beyond

Pub Date : 2006-06-05 DOI: 10.1109/IITC.2006.1648665 T. Usami, T. Ide, Y. Kakuhara, Y. Ajima, K. Ueno, T. Maruyama, Y. Yu, E. Apen, K. Chattopadhyay, B. van Schravendijk, N. Oda, M. Sekine

Low-k properties and integration processes enabling reliable interconnect scaling to the 32 nm technology node

Pub Date : 2006-06-05 DOI: 10.1109/IITC.2006.1648641 A. Ikeda, Y. Travaly, A. Humbert, R. Hoofman, Y. Li, Z. Tokei, F. Iacopi, J. Michelon, C. Bruynseraede, M. Willegems, D. Hendrickx, J. van Aelst, H. Struyf, J. Versluijs, N. Heylen, L. Carbonell, O. Richard, H. Bender, M. Kaiser, R. Weemaes, G. Verheyden, N. Kemeling, A. Fukazawa, N. Matsuki, H. Sprey, I. Ciofi, G. Beyer, M. Van Hove

Reliability Improvement by Adopting Ti-barrier Metal B for Porous Low-k IL Structure

Pub Date : 2006-06-05 DOI: 10.1109/IITC.2006.1648658 A. Sakata, S. Yamashita, S. Omoto, M. Hatano, J. Wada, K. Higashi, H. Yamaguchi, T. Yosho, K. Imamizu, M. Yamada, M. Hasunuma, S. Takahashi, A. Yamada, T. Hasegawa, H. Kaneko

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