3rd Electronics System Integration Technology Conference ESTC

查看最新文献

2223

3rd Electronics System Integration Technology Conference ESTC - 最新文献

Introduction of nanosized Al2O3 in Sn-Ag3,5 solders by mechanical alloying

Pub Date : 2010-11-22 DOI: 10.1109/ESTC.2010.5642940 J. C. Boareto, G. Rodrigues, M. Mastropietro, P. Wendhausen, K. Wolter

TSV as an alternative to wire bonding for a wireless industrial product: another step towards 3D integration

Pub Date : 2010-11-22 DOI: 10.1109/ESTC.2010.5642920 G. Druais, P. Ancey, L. Chapelon, J. Charbonnier, S. Chéramy, Y. Dodo, A. Farcy, G. Garnier, Y. Guillou, D. Henry, P. Leduc, J. Pruvost, E. Saugier, N. Sillon

Biocompatibility assessment of advanced wafer-level based chip encapsulation

Pub Date : 2010-11-22 DOI: 10.1109/ESTC.2010.5642972 E. Dy, R. Vos, J. Rip, A. la Manna, M. Op de Beeck

查看全部

免责声明：
本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。