2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) - 最新文献

Research on Reliability of SnAg1.8/Cu Solder Joints in Extreme Environment

Pub Date : 2022-08-10 DOI: 10.1109/ICEPT56209.2022.9872622 Xiangsheng Zhou, Yuechan Li, Xiaofeng Yang, An Xie, Haozhong Wang, Chunyan Cao

Research on the influence of parallel seam welding parameters on the reliability of thin-walled ceramic package

Pub Date : 2022-08-10 DOI: 10.1109/ICEPT56209.2022.9873244 Zhen-tao Yang, Jiang-tao Chen, Lin-jie Liu, Peng Shi

A Study on Evaluating the Risk of Underfill Delamination During Thermal Cycling by Finite Element Analysis

Pub Date : 2022-08-10 DOI: 10.1109/ICEPT56209.2022.9872616 Cheng Zhong, Chenglong Li, Ruoyu Jiang, Yulong Li, Xu Peng, Gang Li, Pengli Zhu, Jibao Lu, Rong Sun

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