Proceedings of the 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis

Characterisation of chip-on-board and flip chip packaging technologies by acoustic microscopy

Pub Date : 1996-11-01 DOI: 10.1109/ESREF.1996.888219 W. Lawton, J. Barrett

Reliability improvement of single-poly quasi self-aligned bicmos BJTS using base surface arsenic compensation

Pub Date : 1996-11-01 DOI: 10.1109/ESREF.1996.888225 L. Vendrame, T. Gravier, J. Kirtsch, A. Monroy, A. Chantre

Threshold voltage degradation in plasma damaged cmos transistors - role of electron and hole traps related to charging damage

Pub Date : 1996-11-01 DOI: 10.1109/ESREF.1996.888178 T. Brożek, Y. Chan, C. Viswanathan