2020 IEEE International Interconnect Technology Conference (IITC)

2020 IEEE International Interconnect Technology Conference (IITC)
发文信息
历年影响因子
历年发表
投稿信息

2020 IEEE International Interconnect Technology Conference (IITC) - 最新文献

In-situ Electrothermal TEM Investigation of Electromigration in fully Embedded Cu/Co Interconnects

Pub Date : 2020-10-05 DOI: 10.1109/IITC47697.2020.9515592 Miji Lee, D. Chung, Hyo-Young Kim, Miji Lee, Moon-Yong Lee, Jinseok Kim, Hanbyul Kang, H. Rhee, S. Pae

Characterization of interface interactions between Graphene and Ruthenium

Pub Date : 2020-10-05 DOI: 10.1109/IITC47697.2020.9515595 S. Achra, Xiangyu Wu, V. Trepalin, T. Nuytten, Jonathan Ludwig, S. Brems, V. Afanas’ev, C. Huyghebaert, B. Sorée, M. Heyns, I. Asselberghs, Z. Tokei

Resistivity Impact from Modulated Line-Edge-Roughness with Self-aligned Double Patterning

Pub Date : 2020-10-05 DOI: 10.1109/IITC47697.2020.9515619 Dewei Xu, K. Chuang, Wayne W. Zhao, K. Donegan, Seungho Kook, R. Augur, Fox Robert, Jeffery Chee
查看全部
免责声明:
本页显示期刊或杂志信息,仅供参考学习,不是任何期刊杂志官网,不涉及出版事务,特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题,请联系我们,邮箱:info@booksci.cn,我们会认真核实处理。
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信