2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC)

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2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - 最新文献

Ultrathin conformal multilayer SiNO dielectric cap for capacitance reduction in Cu/low k interconnects

Pub Date : 2016-07-11 DOI: 10.1109/IITC-AMC.2016.7507693 D. Priyadarshini, S. Nguyen, H. Shobha, S. Cohen, T. Shaw, C. Parks, E. Adams, J. Burnham, E. Liniger, C. K. Hu, D. Collins, T. Spooner, A. Grill, D. Canaperi, V. Paruchuri, D. Edelstein

Is electron transport in nanocrystalline Cu interconnects surface dominated or grain boundary dominated?

Pub Date : 2016-05-23 DOI: 10.1109/IITC-AMC.2016.7507701 G. Hegde, R. Bowen, M. Rodder

Novel top-down Cu filling of through silicon via (TSV) in 3-D integration

Pub Date : 2016-05-23 DOI: 10.1109/IITC-AMC.2016.7507705 T. Weng, Jun Lu, S. Chang, T. Hsueh

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