ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems

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ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - 最新文献

ASME Conference Presenter Attendance Policy and Archival Proceedings

Pub Date : 2018-08-27 DOI: 10.1115/ipack2018-ns

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Pub Date : 2018-08-27 DOI: 10.1115/IPACK2018-8256 A. Chvála, R. Szobolovszký, J. Kováč, M. Florovič, J. Marek, L. Cernaj, P. Pribytny, D. Donoval, S. Delage, J. Jacquet

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Pub Date : 2018-08-27 DOI: 10.1115/IPACK2018-8436 Gautham Thirunavakkarasu, S. Saini, Jimil M. Shah, D. Agonafer

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