2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration

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2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - 最新文献

Atomic diffusion bonding with thin nanocrystalline metal films in vacuum and in an inert gas

Pub Date : 2012-05-22 DOI: 10.1109/LTB-3D.2012.6238077 T. Shimatsu, M. Uomoto

Fine pitch micro-bump Cu/Sn solid state diffusion bonding with and without surface planarization

Pub Date : 2012-05-22 DOI: 10.1109/LTB-3D.2012.6238049 Wenqi Zhang, A. L. Manna, P. Soussan, E. Beyne

Copper-oxide reduction for low-temperature wafer bonding

Pub Date : 2012-05-22 DOI: 10.1109/LTB-3D.2012.6238047 B. Rebhan, S. Tollabimazraehno, T. Plach, G. Hesser, J. Burggraf, G. Mittendorfer, V. Dragoi, M. Wimplinger, K. Hingerl

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