2013 IEEE International Symposium on Electromagnetic Compatibility

查看最新文献

2124

2013 IEEE International Symposium on Electromagnetic Compatibility - 最新文献

In-band spurious attenuation in LTE-class RFIC chip using a soft magnetic thin film

Pub Date : 2014-02-10 DOI: 10.1109/EMCCOMPO.2013.6735171 S. Muroga, Y. Shimada, Y. Endo, Satoshi Tanaka, M. Yamaguchi, N. Azuma, M. Nagata, M. Murakami, K. Hori, Satoru Takahashi

High-frequency EMC design verification through full-wave simulations and measurements in Reverberation Chamber

Pub Date : 2013-11-21 DOI: 10.1109/ISEMC.2013.6670427 Xiaoxia Zhou, Jing Li, Hongmei Fan, A. Bhobe, P. Sochoux, Jinghan Yu

De-embedding techniques for transmission lines: An exploration, review, and proposal

Pub Date : 2013-11-21 DOI: 10.1109/ISEMC.2013.6670527 Nicholas Erickson, K. Shringarpure, J. Fan, B. Achkir, Siming Pan, C. Hwang

查看全部

免责声明：
本页显示期刊或杂志信息，仅供参考学习，不是任何期刊杂志官网，不涉及出版事务，特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题，请联系我们，邮箱：info@booksci.cn，我们会认真核实处理。