2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

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2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - 最新文献

Copper Ball Bond over a Variety of Probe Marks in Two Pad Aluminum Thicknesses

Pub Date : 2016-08-18 DOI: 10.1109/ECTC.2016.382 Jacob Marsh, Austin Doutre, Kyle Syndergaard, P. Brown, Kok Inn Hoo, E. De Jesus, Stevan Hunter

Analysis and Measurement of Power Integrity and Jitter Impacts on Thin-Core and Coreless Packages

Pub Date : 2016-08-18 DOI: 10.1109/ECTC.2016.323 Y. Hahm, Ming Li, John Yan, Yuri Tretiakov, H. Lan, Scott Chen, Simon Wang

Electrical Model of Different Architectures of through Silicon Capacitors for High Frequency Power Distribution Network (PDN) Decoupling Operations

Pub Date : 2016-08-18 DOI: 10.1109/ECTC.2016.335 K. Dieng, C. Bermond, P. Artillan, T. Lacrevaz, G. Houzet, B. Fléchet, O. Guiller, S. Joblot, A. Farcy, Y. Lamy

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