Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - 最新文献
Pub Date : 2021-11-17
DOI: 10.1201/9781003247005-11
J. Cepeda-Rizo, J. Gayle, Joshua A. Ravich
Pub Date : 2021-11-17
DOI: 10.1201/9781003247005-15
J. Cepeda-Rizo, J. Gayle, Joshua A. Ravich
Pub Date : 2021-11-17
DOI: 10.1201/9781003247005-4
J. Cepeda-Rizo, J. Gayle, Joshua A. Ravich
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